Delta Electronics Delphi Series DNS Instrukcja Użytkownika Pobierz pdf (Strona 13)

DS_DNS10SMD06_03092009

PICK AND PLACE LOCATION SURFACE-MOUNT TAPE & REEL

LEADED PROCESS RECOMMEND TEMP. PROFILE

Time ( sec. )

Pre-heat temp.

140~180

C 60~120 sec.

Peak temp.

210~230

C 5sec.

Ramp-up temp.

0.5~3.0

C /sec.

Temperature (°C )

100

150

200

250

300 60 0 120 180 240

2nd Ramp-up temp.

1.0~3.0

C /sec.

Over 200

40~50sec.

Cooling down rate <3

C /sec.

Note: All temperature refers to assembly application board, measured on the land of assembly application board.

LEAD FREE (SAC) PROCESS RECOMMEND TEMP. PROFILE

Note: All temperature refers to assembly application board, measured on the land of assembly application board.

Temp

Time

150

℃

200℃

90~120 sec.

Time Limited 75 sec.

above 220

℃

220

℃

Preheat time

Ramp up

max. 3

℃

/sec.

Ramp down

max. 4

℃

/sec.

Peak Temp. 240 ~ 245

℃

1 2 ... 8 9 10 11 12 13 14 15

FEATURES 1
APPLICATIONS 1
OPTIONS 1
TECHNICAL SPECIFICATIONS 2
Remote no/off 5
TEST CONFIGURATIONS 6
DESIGN CONSIDERATIONS 6
DESIGN CONSIDERATIONS (CON.) 7
FEATURES DESCRIPTIONS 7
FEATURES DESCRIPTIONS (CON.) 8
FEATURE DESCRIPTIONS (CON.) 10
THERMAL CONSIDERATIONS 11
THERMAL CURVES 12
DS_DNS10SMD06_03092009 13
MECHANICAL DRAWING 14
MODEL LIST 15
PART NUMBERING SYSTEM 15

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Delta Electronics Delphi Series DNS Instrukcja Użytkownika Strona 13

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